Infineon and Skeleton partner on solid-state transformers and supercapacitor sidecars for AI data center power resilience

Infineon Technologies AG and Skeleton Technologies, a global leader in high-power energy storage systems for applications including AI data centers, have signed a Memorandum of Understanding to jointly develop high-efficiency, resilient power solutions for modern data center infrastructure. The collaboration comes as surging AI workloads, escalating power demand, and the need for highly reliable digital infrastructure are driving a fundamental shift in how data center power architectures are designed and deployed.

Under the agreement, the two companies will explore and develop advanced architectures spanning the entire AI data center power chain, from grid connection to processor core. A central focus is the advancement of next-generation solid-state transformers (SSTs) for medium-voltage AC to high-voltage DC conversion, alongside high-power sidecar systems designed to strengthen system resilience. These technologies are becoming increasingly critical building blocks for AI data center infrastructure, enabling more efficient power conversion from grid to core and delivering higher overall system reliability.

The companies intend to combine Infineon's high-efficiency high-voltage CoolSiC™ power semiconductors with Skeleton's expertise in power conversion systems and supercapacitor technology. In addition, the partnership will target gallium nitride (GaN)-based peak-shaving systems that integrate Skeleton's advanced supercapacitor technology with Infineon's CoolGaN™ power semiconductors. By merging complementary technologies and system-level know-how, the collaboration aims to deliver breakthrough improvements in energy efficiency, power density, and system reliability, while helping reduce the total cost of ownership for data center operators.

"AI is fundamentally transforming power infrastructure requirements. The increasing power density of modern data centers calls for new approaches to energy conversion, distribution and storage," said Andreas Weisl, Executive Vice President and Chief Sales Officer of Industrial and Infrastructure at Infineon. "By combining Infineon's expertise in power semiconductors with Skeleton's innovation in supercapacitor technology and power conversion systems, we are driving the development of highly efficient and resilient power architectures that meet the demands of next-generation AI workloads."

Taavi Madiberk, CEO of Skeleton Technologies, echoed that sentiment, noting that power density has become one of the defining constraints of AI infrastructure globally. "AI data centers need to deliver dramatically more power to increasingly dense GPU infrastructure, without allowing the power system itself to consume more space. Infineon and Skeleton Technologies are both working at the forefront of that challenge. By combining Infineon's precision in converting and controlling power with Skeleton's expertise in storing and delivering very high power at speed, we can increase power density across the AI power infrastructure and enable more compute within the same physical footprint."

The partnership reflects a broader industry trend in which power delivery architecture is emerging as a critical enabler for next-generation AI compute. As GPU densities climb and rack-level power requirements surge, the efficiency of conversion and distribution systems from the grid to the processor becomes as important as the compute hardware itself. The collaboration between Infineon and Skeleton signals growing recognition among infrastructure players that advanced power electronics and energy storage must evolve in tandem to support the scale and reliability demands of AI-era data centers.